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Kendric Rendle-Short on Muck Rack

Kendric Rendle-Short

As seen in: MDPI
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Characterisation of Curing of Vinyl Ester Resin in an Industrial Pultrusion Process: Influence of Die Temperature

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By Omar Alajarmeh, Tristan Shelley, Xuesen Zeng, Kendric Rendle-Short
| MDPI
3. Results 3.1. Thermal Behaviour of Resin in DSC Trials Figure 3 presents the results of the heat flow response using DSC of the resin and focuses on the difference in evolution of heat flow between 80 °C and 140 °C and the similarity in the heat flow beyond 140 °C until 220 °C. There is a distinct change in the heat flow peak between 80 °C and 140 °C, with a slight downward heat flow reduction trend above 140 °C.
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