Ki Cheol Chang

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1. Introduction Epoxy resins are widely used thermosetting resins in various industries for various applications, such as coatings, adhesives, insulators, and matrixes for composite materials, because of their excellent electrical insulation, low molding shrinkage, good adhesion, and heat resistance [1,2,3,4,5]. However, their curing behaviors are complex and depend on various factors, such as temperature, molecular mobility, and crosslinking reactions [6,7,8].