KunSang Park on Muck Rack

KunSang Park

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Enhancing bonding strength of the electroplated Cu pillars for semiconductor package by controlling grain orientation - Scientific Reports

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By JaeJun Yoon, TaekSoo Shin, Dongjin Kim, KunSang Park, DongKeun Na, Yeonju Go, Seung Boo Jung
| Nature Verified
Abstract The Cu pillar bump, an electrode formed on a silicon chip, connects the devices inside a high bandwidth memory (HBM) package and is the most important interconnection affecting the electrical, thermal, and mechanical properties of advanced semiconductor package. Recently, the number of input/output (I/O) in HBM packages has been increasing and the fine pitch of Cu pillar is also becoming significantly smaller.
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