Hierarchically Encapsulated Phase-Change Film with Multi-stage Heat Management Properties and Conformable Self-Interfacing Contacts for Enhanced Interface Heat Dissipation Lu Qing, Xiang Wang, Hong-wei Zhao, Xun-rui Wang, Jia-qing Zhao, Haoran Kong, Tao Wang, Chao Liang, Jinhong Li and Wayne Qiang Xu Abstract With the rapid evolution of power and packing densities of microelectronic and energy storage devices, timely heat dissipation towards instantaneous high intensity heat flow is becoming...