Masahisa Fujino on Muck Rack

Masahisa Fujino

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Articles

Void-free Cu/dielectric hybrid bonding at low-temperature enabled by ultrathin metal passivation engineering for 3D-IC applications

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By Tanmay Ghosh, Ratan Umralkar, Hemanth Kumar Cheemalamarri, Masahisa Fujino, Chandra Rao B.S.S, Navab Singh, Srinivasa Rao Vempati
| Nature Verified
Abstract Copper (Cu) surface topography, galvanic corrosion at the Cu-barrier interface and Cu-to-dielectric bonding primarily due to the misalignment are the present critical challenges in achieving void-free hybrid bonding. Additionally, Cu surface oxidation and dishing remain key bottlenecks in enabling reliable Cu interconnections at low temperatures in Cu/dielectric (SiO₂) hybrid bonding.
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