EE Times
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EE Times offers design engineers and management executives news and analysis of the latest technologies and business developments in the global electronics industry. Award-winning journalists and subject matter experts strive to cover not just what happened today but why it happened and what it portends for the future. Source
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| Scope | International, Trade/B2B |
|---|---|
| Language | English |
| Country | United States of America |
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Recent Articles
Search ArticlesQualcomm Bets Open-Source AI Software Can Break Nvidia’s Lock-In
designLines AI & Big Data Designline By Pat Brans 08.27.2026 0 Share this: Share on X (Opens in new window) X Share on Facebook (Opens in new window) Facebook Share on LinkedIn (Opens in new window) LinkedIn //php echo do_shortcode('[responsivevoice_button voice="US English Male" buttontext="Listen to Post"]') ?> Qualcomm wants to sell more AI accelerators. Yet one of its biggest software bets is designed to make developers care less about which accelerator they’re using.
NewPower Worldwide Expands Credit Facility to $750 Million to Support Global Growth and Customer Demand
Latest expansion strengthens NewPower’s ability to invest in inventory, respond to market opportunities, and support customers worldwide.
Why Connectivity Has Become an Edge AI Design Decision
designLines AI & Big Data Designline By Neeta Shenoy 08.27.2026 0 Share this: Share on X (Opens in new window) X Share on Facebook (Opens in new window) Facebook Share on LinkedIn (Opens in new window) LinkedIn //php echo do_shortcode('[responsivevoice_button voice="US English Male" buttontext="Listen to Post"]') ?> In real-world edge AI systems, the AI model is only one part of the design.
NVMe 2.4 Update Adds Post-Quantum Security, Power Controls
designLines AI & Big Data Designline By Gary Hilson 08.26.2026 0 Share this: Share on X (Opens in new window) X Share on Facebook (Opens in new window) Facebook Share on LinkedIn (Opens in new window) LinkedIn //php echo do_shortcode('[responsivevoice_button voice="US English Male" buttontext="Listen to Post"]') ?> As the non-volatile memory express (NVMe) protocol moves to an annual release cycle, the latest updates reflect the growing maturity of the ecosystem and the rapid pace of...
Why Automation Is Essential to Achieve EU CRA Compliance
"Partner Content" allows today's industry thought leaders to share their unique insight and perspective with the greater ASPENCORE audience.
Reliable Power-Path Design: Integrating MOSFETs, Diodes, TVS Devices, and Capacitors
"Partner Content" allows today's industry thought leaders to share their unique insight and perspective with the greater ASPENCORE audience. Material published as "Partner Content" was created by or on behalf of ASPENCORE's partner(s) in conjunction with the ASPENCORE Studio team and may not reflect the views of the site and editors to which it is published.For more information on this program, email support@aspencore.com designLines Power Management Designline By Unikey Electronics Pte. Ltd.
From Days to Minutes: Accelerating 3D IC Debug with Agentic AI
"Partner Content" allows today's industry thought leaders to share their unique insight and perspective with the greater ASPENCORE audience.
Accelerating Silicon Design for Physical AI
designLines AI & Big Data Designline A complete path from AI model to trusted silicon, to deployable system By Cadence Design Systems 08.26.2026 0 Share this: Share on X (Opens in new window) X Share on Facebook (Opens in new window) Facebook Share on LinkedIn (Opens in new window) LinkedIn //php echo do_shortcode('[responsivevoice_button voice="US English Male" buttontext="Listen to Post"]') ?> Physical AI systems must perceive, reason, and act at once, under tight real-time latency and...
India’s OSAT-ATMP Build-Out: From Legacy Packages to 2.5D
designLines SoC Designline By Yashasvini Razdan 08.26.2026 0 Share this: Share on X (Opens in new window) X Share on Facebook (Opens in new window) Facebook Share on LinkedIn (Opens in new window) LinkedIn //php echo do_shortcode('[responsivevoice_button voice="US English Male" buttontext="Listen to Post"]') ?> Hyderabad, India–based Advanced System in Package (ASIP) Technologies has begun construction of an outsourced semiconductor assembly and test (OSAT) facility in Visakhapatnam, Andhra...
The Complete IoT Mesh Solution: Making Wi-SUN Deployments Simple
By Digi, Silicon Labs, Arrow Electronics 08.25.2026 0 Share this: Share on X (Opens in new window) X Share on Facebook (Opens in new window) Facebook Share on LinkedIn (Opens in new window) LinkedIn //php echo do_shortcode('[responsivevoice_button voice="US English Male" buttontext="Listen to Post"]') ?> Date: Tuesday, September 29, 2026 Time: 8:00am PDT | 11:00am EDT | 17:00 CEST Scaling IoT deployments shouldn’t mean scaling costs.