EE Times
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EE Times offers design engineers and management executives news and analysis of the latest technologies and business developments in the global electronics industry. Award-winning journalists and subject matter experts strive to cover not just what happened today but why it happened and what it portends for the future. Source
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| Scope | International, Trade/B2B |
|---|---|
| Language | English |
| Country | United States of America |
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Recent Articles
Search ArticlesSolid-State Transformers: Accelerate Your SST Design
By Infineon Technologies, Arrow Electronics 10.09.2026 0 Share this: Share on X (Opens in new window) X Share on Facebook (Opens in new window) Facebook Share on LinkedIn (Opens in new window) LinkedIn //php echo do_shortcode('[responsivevoice_button voice="US English Male" buttontext="Listen to Post"]') ?> Date: Thursday, November 19, 2026 Time: 8:00am PST | 11:00am EST | 17:00 CET Unlock the future of advanced power distribution.
Connecting Chiplets Isn’t Enough – Solving the Data Movement Challenge in Multi-Die Systems
By Arteris 10.09.2026 0 Share this: Share on X (Opens in new window) X Share on Facebook (Opens in new window) Facebook Share on LinkedIn (Opens in new window) LinkedIn //php echo do_shortcode('[responsivevoice_button voice="US English Male" buttontext="Listen to Post"]') ?> Date: Thursday, November 5, 2026 Time: 11:00am PST | 2:00pm EST | 18:00 CET As SoCs evolve into multi-die systems, getting data across a die-to-die interface is only part of the challenge.
Manfred Horstmann: GlobalFoundries Bets on FDX Fusion for Physical AI
designLines AI & Big Data Designline GlobalFoundries said strained-silicon FD-SOI can deliver 7-nm-class performance without EUV and open a new market for Europe. By Pat Brans 10.09.2026 0 Share this: Share on X (Opens in new window) X Share on Facebook (Opens in new window) Facebook Share on LinkedIn (Opens in new window) LinkedIn //php echo do_shortcode('[responsivevoice_button voice="US English Male" buttontext="Listen to Post"]') ?> GlobalFoundries today (Oct.
U.S. Manufacturing Activity Sustains Growth in September as Backlogs Surge
designLines Automotive Designline Manufacturing maintains nine-month growth streak despite soaring costs and trade barriers.
Physical AI Needs a Neuromorphic Path from Sensor to Silicon
designLines AI & Big Data Designline Physical AI will be limited in the real world if we keep pretending that physical data comes packaged like the digital world. By Xabier Iturbe 10.09.2026 0 Share this: Share on X (Opens in new window) X Share on Facebook (Opens in new window) Facebook Share on LinkedIn (Opens in new window) LinkedIn //php echo do_shortcode('[responsivevoice_button voice="US English Male" buttontext="Listen to Post"]') ?> The physical world does not wait for a sampling clock.
Worlds First Single Chip Multiturn Position Sensor in Smaller Form Factor
By Analog Devices 10.09.2026 0 Share this: Share on X (Opens in new window) X Share on Facebook (Opens in new window) Facebook Share on LinkedIn (Opens in new window) LinkedIn //php echo do_shortcode('[responsivevoice_button voice="US English Male" buttontext="Listen to Post"]') ?> Dates: October 21st or October 28th Position sensing technologies are essential to modern motion control systems, yet most non-contact sensing solutions, including Hall, AMR, GMR, TMR, inductive, optical, and...
Scaling 3D IC design: Trends, Challenges and Practical Workflows
By Siemens EDA 10.09.2026 0 Share this: Share on X (Opens in new window) X Share on Facebook (Opens in new window) Facebook Share on LinkedIn (Opens in new window) LinkedIn //php echo do_shortcode('[responsivevoice_button voice="US English Male" buttontext="Listen to Post"]') ?> Available Exclusively On Demand 3D IC architectures are enabling the next generation of AI, HPC, and advanced semiconductor systems – but scaling these designs introduces new challenges across heterogeneous...
Why Custom Silicon Matters in AI Data Centers
designLines AI & Big Data Designline Custom silicon lets AI data centers cut power, latency and data movement while improving economics at scale. By Scott Seal 10.08.2026 0 Share this: Share on X (Opens in new window) X Share on Facebook (Opens in new window) Facebook Share on LinkedIn (Opens in new window) LinkedIn //php echo do_shortcode('[responsivevoice_button voice="US English Male" buttontext="Listen to Post"]') ?> General-purpose processors are not going away.
SCHIEDERWERK Showcases Novel Power Supply Solutions for Mission-Critical Applications at electronica 2026
By SCHIEDERWERK 10.08.2026 0 Share this: Share on X (Opens in new window) X Share on Facebook (Opens in new window) Facebook Share on LinkedIn (Opens in new window) LinkedIn //php echo do_shortcode('[responsivevoice_button voice="US English Male" buttontext="Listen to Post"]') ?> Nuremberg / Munich, Germany, 2026 — SCHIEDERWERK GmbH, a specialist in custom power electronics solutions engineered and manufactured in Germany, will showcase its latest platform-based power supplies and innovative...
NVIDIA Jetson to SiMa.ai Modalix MLSoC Migration Guide
designLines SoC Designline Practical steps for migrating models and applications from NVIDIA/CUDA workflows using the SiMa.ai Palette software stack. By SiMa Technologies, Inc.