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Alan Patterson

Chicago
As seen in: EE Times, Amazon Web Services, Oracle, Fixing the Future, ACM Queue, IT Media, SHRM HR News, NewsBreak, CEOWORLD Magazine, EDN: Voice of the Engineer, Embedded and
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Articles

TSMC’s HBM-Packaging Yield Issues Help Intel, Analysts Say

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By Alan Patterson
| D&R DAC 22 Podcasts
August 27, 2026 - By Alan Patterson, EE Times TSMC’s difficulty stitching together AI accelerators with high-bandwidth memory (HBM) on a single chip gives Intel a chance to win foundry customers, according to Counterpoint Research co-founder Neil Shah and other analysts commenting to EE Times. TSMC’s CoWoS advanced packaging tech, which has been a mainstay for AI customers like Nvidia, AMD, and Broadcom for years, has become a production bottleneck, Shah said in an Aug.
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Smartphone Industry Faces Margin Squeeze as Memory and Logic Costs Surge

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By Alan Patterson
| EE Times Asia
Article By : Alan Patterson Soaring memory and logic prices are squeezing smartphone margins, forcing manufacturers to raise prices or absorb costs. Apple and its smartphone rivals face a dilemma caused by soaring memory and logic costs that leaves them two choices: swallow losses or fight a pyrrhic battle for market share. Average selling prices (ASPs) for smartphone memories such as DRAM have quadrupled, while ASPs for NAND have tripled in the last twelve months, according to an Aug.
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TSMC’s HBM-Packaging Yield Issues Help Intel, Analysts Say

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By Alan Patterson
| EE Times Verified
designLines AI & Big Data Designline By Alan Patterson 08.25.2026 0 Share this: Share on X (Opens in new window) X Share on Facebook (Opens in new window) Facebook Share on LinkedIn (Opens in new window) LinkedIn //php echo do_shortcode('[responsivevoice_button voice="US English Male" buttontext="Listen to Post"]') ?> TSMC’s difficulty stitching together AI accelerators with high-bandwidth memory (HBM) on a single chip gives Intel a chance to win foundry customers, according to Counterpoint...
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