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Ponnusami Selvakumar on Muck Rack

Ponnusami Selvakumar

As seen in: Taylor & Francis Online
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Articles

Exploring processing methods and interface features to enhance thermal conductivity in copper/diamond composites: a comprehensive review

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By Uthayakumar Marimuthu, Nixon Poulose, Ponnusami Selvakumar
| Taylor & Francis Online
ABSTRACT Recent advances in copper/diamond composites have demonstrated thermal conductivities approaching 900 W/(m·K) and enhanced interfacial bonding through optimised processing and interface engineering. Our integrated review reveals that by fine-tuning sintering conditions and incorporating carbide-forming elements, the interfacial thermal resistance can be reduced by approximately 20%, resulting in a 15% overall improvement in composite thermal performance.
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