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Articles

Non-destructive techniques for identifying defects in BGA joints

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By Zhen Feng, Juan Gonzalez, Juan Carlos González, Murad Kurwa, Sea Tang
| Dataweek Verified
Manufacturing / Production Technology, Hardware & Services printer friendly version Non-destructive techniques for identifying defects in BGA joints – TDR, 2DX, and cross-section-SEM comparison The electronic manufacturing industry needs non-destructive techniques to identify BGA opens and cracks. Currently X-ray and time domain reflectometry (TDR) are most widely used.
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