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Articles by Tobias Gleichmann
Mycronic appoints Peter Andries as General Manager of MRSI Systems and VP of Global Technologies Division
Peter has more than 20 years of international leadership experience in business development, operations, and strategic growth. Peter most recently served as Vice President and General Manager for the Americas at Soleras Advanced Coatings, where he led initiatives to strengthen regional operations, expand manufacturing capacity, and secure long-term strategic agreements.
IMAPS 3D InCites Content Platform
Die bonding is a manufacturing process used in the packaging of semiconductors. It is the act of attaching a die (or chip) to a substrate or package by epoxy or solder, also known as die placement or die attach. The process starts with picking a die from a wafer or waffle pack and then placing it at a specific location on the substrate. The die is placed into a previously dispensed epoxy or placed into solder (eutectic).
How Implantable Brain-Computer Interfaces Are Pushing the Boundaries of Precision Die Bonding
A patient who can no longer speak generates text directly from neural activity. A patient with paralysis controls a cursor using thought alone. Behind demonstrations like these is a difficult engineering problem: how do you assemble electronics delicate enough to interact with the human brain, while keeping them stable inside the body for years? Implantable Brain-computer interfaces (BCIs) are moving steadily from research labs toward real medical applications.
Trends in Semiconductor Manufacturing: Wafer-Level and Panel-Level Packaging
One of the most important shifts in semiconductor manufacturing today is not just the continued growth of wafer-level packaging (WLP), but the increasing reliance on enabling, highly specialized process technologies.
Amkor Advances Arizona’s Semiconductor Future
Innovating the future of semiconductor packaging, creating local opportunities and strengthening our community! West-MEC on the opened the nation’s first K–12 CTE semiconductor cleanroom earlier today. This milestone represents an important step in building early awareness, hands-on experience, and a stronger talent pipeline for the semiconductor industry. Amkor Technology, Inc.
Why Die Bonding Fails to Scale: How Do You Move from Prototype to Production Without Starting Over?
By Tobias Gleichmann In advanced packaging, the real challenge usually doesn’t show up during development. It shows up when processes need to run reliably in production. Everything works in the lab. Then production begins. And suddenly, nothing behaves the same. But in many cases, the issue was already built in. If the bonding strategy is not validated with production in mind, cost and risk are carried forward from the very beginning. That is why problems appear later.
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