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Wen-Yee Lee

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Articles

Taiwan breaks ground on advanced packaging park anchored by TSMC

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By Wen-Yee Lee
| ETTelecom Verified
Devices 2 min read Lai said the park would allow key equipment and materials suppliers to conduct research, testing and validation at the site, shortening the time needed to bring new technologies into mass production and helping local companies enter the advanced chipmaking supply chain.
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Taiwan breaks ground on advanced packaging park anchored by TSMC

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By Wen-Yee Lee
| KDAL-FM (Duluth , MN) Verified
By Wen-Yee Lee TAIPEI, Sept 21 (Reuters) – Taiwan broke ground on a new advanced packaging industrial park in the southern city of Kaohsiung on Monday, where TSMC plans to establish facilities for technology validation ​and talent training. TSMC, the world’s largest contract chipmaker, will build ‌two buildings at the Baipu Industrial Park, including a technology validation laboratory and a talent training centre, Kaohsiung Deputy Mayor Lo Ta-sheng said at the groundbreaking ceremony.
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