Wyatt Hodges

1 Introduction In recent years, increasing heat loads in microelectronics[1] have driven innovative thermal design for improved heat dissipation.[2, 3] Often the pain point in thermal management originates at the interface between two differing materials,[4-6] particularly when the electronic devices are predominantly made of high thermal conductivity materials such as silicon.

Heterogeneous integration (HI) of microelectronic devices allows for an electronic system to be realized by combining integrated circuits with different functions into a single chip. (1) Commonly, this integration occurs through the use of thermocompression bonding of metallic interconnects that can range from tens to hundreds of microns in diameter.