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Towards Electrical Insulation Electromagnetic Interference Shielding Materials: Magnetic Network-Microcapacitors Framework for Advanced Electronics Packaging
Towards Electrical Insulation Electromagnetic Interference Shielding Materials: Magnetic Network-Microcapacitors Framework for Advanced Electronics Packaging To meet the challenges of Moore's Law, next-generation chips have been constructed with increasingly complex multilayer architectures. Traditional electromagnetic interference (EMI) shielding materials designed with high electrical conductivity as the primary principle are prone to electrical reliability issues in electronic devices.
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