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Yangning Tian on Muck Rack

Yangning Tian

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Articles

Effect of Thermal Aging on the Reliability of Interconnected Nano-Silver Solder Joints

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By Xiaodong Jian, Mingrui Zhao, Jiahao Liu, Yangning Tian
| MDPI
All articles published by MDPI are made immediately available worldwide under an open access license. No special permission is required to reuse all or part of the article published by MDPI, including figures and tables. For articles published under an open access Creative Common CC BY license, any part of the article may be reused without permission provided that the original article is clearly cited. For more information, please refer to https://www.mdpi.com/openaccess.
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