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Plasma Spraying Al 2 O 3 and TiO 2 -Doped Al 2 O 3 Ceramics Coatings for the Repair of Worn Electrostatic Chuck
1 Introduction Electrostatic chucks (ESCs), which utilize electrostatic forces to secure wafers during semiconductor manufacturing, are essential components in semiconductor processes such as physical vapor deposition (PVD), chemical vapor deposition (CVD), lithography, etching, and diffusion [1, 2]. Their performance has a direct impact on wafer processing precision, thermal management, and overall process stability.
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