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Yingchong Zhang

As seen in: MDPI
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Articles

Research Progress on Bonding Wire for Microelectronic Packaging

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By Hongliang Zhou, Jun Cao, Chenghao Su, Yingchong Zhang
| MDPI
Abstract : Wire bonding is still the most popular chip interconnect technology in microelectronic packaging and will not be replaced by other interconnect methods for a long time in the future. Au bonding wire has been a mainstream semiconductor packaging material for many decades due to its unique chemical stability, reliable manufacturing, and operation properties.
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