Yingjie Yao
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Low-Temperature Fabrication of High-Performance Cross-Linked Polyimide Films via Rapid Ultraviolet Irradiation
Conflicts of Interest The authors declare no conflicts of interest. Data Availability Statement The data that supports the findings of this study are available in the of this article. Supporting Information Filename Description app71074-sup-0001-Supinfo.docxWord 2007 document , 319.4 KB Figure S1: XRD curves of the polyimide films CPI50-100 and CPI50-0. Figure S2: DMA curves of the polyimide films CPI50-0 (a) and CPI50-100 (b). Table S1: Materials formulation of different theoretical DP.
Chain Dynamics of Partially Disentangled UHMWPE around Melting Point Characterized by 1H Low-Field Solid-State NMR
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Chemical boundary engineering: A new route toward lean, ultrastrong yet ductile steels
Abstract For decades, grain boundary engineering has proven to be one of the most effective approaches for tailoring the mechanical properties of metallic materials, although there are limits to the fineness and types of microstructures achievable, due to the rapid increase in grain size once being exposed to thermal loads (low thermal stability of crystallographic boundaries).
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