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Yuying Sui

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Articles

Scalable SiO2/Epoxy Dielectric Films for High‐Yield and Fine‐Line Substrate Fabrication via Copper Tooth Transfer Printing

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By Suibin Luo, Yuying Sui, Junyi Yu, Chunbo Gao
| Wiley Online Library Verified
Conflict of Interest The authors declare no conflict of interest. Data Availability Statement The data that support the findings of this study are available from the corresponding author upon reasonable request. References 1, , , , , , , 2025 IEEE 75th Electronic Components and Technology Conf. (ECTC) 2025, pp. 953–957. 2, , , , , , , , 2025 IEEE 75th Electronic Components and Technology Conf. (ECTC) 2025, pp. 812–818, https://doi.org/10.1109/ectc51687.2025.00142.
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Hydroxyl‐Terminated Polyphenylene Oxide Improved Thermal and Dielectric Properties of Active Ester Cured SiO2/Epoxy Composites for Advanced Electronic Packaging

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By Yuanhang Chen, Yuying Sui, Peng Li, Feng Zhang
| Wiley Online Library Verified
Conflict of Interest The authors declare no conflict of interest. Supporting Information Filename Description adem202402636-sup-0001-SuppData-S1.pdf512.1 KB Supplementary Material References 1a) , , , , , ACS Appl. Nano Mater. 2023, 6, 16768; b) , , , , , , , , J. Mater. Chem. C 2022, 10, 6196; c) , , , J. Mater. Chem. A 2024, 12, 12721. 2a) , , , , , , Polym. Compos. 2020, 41, 4550; b) , , , , , , , , , Compos. Commun. 2021, 25, 100601; c) , , , , , , Adv. Compos. Hybrid Mater.
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Low‐dielectric and low‐temperature curable fluorinated nano carbon/polyimide composites with 6‐aminoquinoline for end capping

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By Jialin Zhang, Yuying Sui, Jinhui Li, Liang Shan
| Wiley Online Library Verified
Abstract One challenge in the high-performance dielectric material of polyimide (PI) is to obtain the excellent comprehensive properties at low curing temperature for advanced IC package. In this work, 6-aminoquinoline (AQL) is introduced through covalent bonds for end capping to obtain a low-temperature curable PI at first. The results demonstrate that with very limited introduce (2.76%) of AQL, the imidization index could reach as high as 1.01 at 200°C.
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