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Barbara Della Porta on Muck Rack

Barbara Della Porta

  • Audience Engagement Specialist, EEWeb
Pescara
As seen in: EEWeb, EE Times Europe, Power Electronics News
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Articles

FeRAM-embedded ASSP in Smart Contact Lenses

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By Barbara Della Porta
| EE Times Europe Verified
RAMXEED developed an ultra-small FeRAM chipset measuring just 1.04 mm2. Since this product was designed for SEED’s smart contact lenses platform, RAMXEED had to meet the rigorous 1 mm2 size requirement by leveraging its advanced design capabilities of combining FeRAM and analog semiconductor technology. What technological innovations made this possible?
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Advanced 5G NTN Development and Innovation

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By Barbara Della Porta
| EE Times Europe Verified
Bristol, United Kingdom, 15 October 2025, Vicinity Technologies Limited, a leading provider of 5G infrastructure solutions, today announces it has been awarded €2.4 million in grant funding from the European Space Agency (ESA) and UK Space Agency (UKSA) to develop end-to-end Non-Terrestrial Network (NTN) solutions.
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Flash Memory & AI: 2mm Tech Driving Assembly Innovation

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By Barbara Della Porta
| EE Times Europe Verified
32 memory dies assembled into a single package The rapid growth of AI has accelerated demand for flash memory capacity. KIOXIA has successfully developed large-capacity 8 TB (terabyte) flash memory by assembling 32 pieces of 2 Tb (terabit) memory dies into a package less than 2 mm in height. This achievement was made possible with advanced assembly process technologies, including the technology for making wafers as thin as possible.
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