Barbara Della Porta

RAMXEED developed an ultra-small FeRAM chipset measuring just 1.04 mm2. Since this product was designed for SEED’s smart contact lenses platform, RAMXEED had to meet the rigorous 1 mm2 size requirement by leveraging its advanced design capabilities of combining FeRAM and analog semiconductor technology. What technological innovations made this possible?

Bristol, United Kingdom, 15 October 2025, Vicinity Technologies Limited, a leading provider of 5G infrastructure solutions, today announces it has been awarded €2.4 million in grant funding from the European Space Agency (ESA) and UK Space Agency (UKSA) to develop end-to-end Non-Terrestrial Network (NTN) solutions.

32 memory dies assembled into a single package The rapid growth of AI has accelerated demand for flash memory capacity. KIOXIA has successfully developed large-capacity 8 TB (terabyte) flash memory by assembling 32 pieces of 2 Tb (terabit) memory dies into a package less than 2 mm in height. This achievement was made possible with advanced assembly process technologies, including the technology for making wafers as thin as possible.