Bongtae Han on Muck Rack

Bongtae Han

As seen in: MDPI, Electronics Cooling
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Articles

Enhanced DMA Test Procedure to Measure Viscoelastic Properties of Epoxy-Based Molding Compound: Multiple Oscillatory Strain Amplitudes and Monotonic Loading

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By Sukrut Prashant Phansalkar, Roshith Mittakolu, Bongtae Han, Taehwa Kim
| MDPI
All articles published by MDPI are made immediately available worldwide under an open access license. No special permission is required to reuse all or part of the article published by MDPI, including figures and tables. For articles published under an open access Creative Common CC BY license, any part of the article may be reused without permission provided that the original article is clearly cited. For more information, please refer to https://www.mdpi.com/openaccess.
Open in Who Shared View Duplicates (552) Issue with article?

Investigation of Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan: An Overlooked Second Reaction

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By Ran Tao, Aaron Forster, Sukrut Prashant Phansalkar, Bongtae Han
| nist.gov
Author(s) , Sukrut Prashant Phansalkar, , Bongtae Han Abstract Cure kinetics of epoxy molding compounds (EMCs) is a fundamental material property that affects the molding process of semiconductor chips and final package performance. However, due to measurement challenges related to the small polymer fraction, only the main reaction is considered in the current industry practice for EMC cure kinetics evaluation.
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Optical Measurement Of Flip-Chip Package Warpage And Its Effect On Thermal Interfaces

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By Bongtae Han
| Electronics Cooling
Flip chip technology has emerged as an important chip-level package solution to meet the ever-increasing demand of high I/O requirements. The flip chip technology was implemented originally for a multi-layer ceramic substrate. In the ceramic flip chip package, a shear strain in each bump, produced by the mismatch of the coefficient of thermal expansion (CTE) between the chip and the ceramic substrate, is proportional to its distance from the neutral point (DNP).
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