Gaurang R. Bhatt

Abstract Field-deployable integrated photonic devices co-packaged with electronics will enable important applications such as optical interconnects, quantum information processing, precision measurements, spectroscopy and microwave generation. Significant progress has been made over the past two decades on increasing the functional complexity of photonic chips.

Abstract Integrated microcombs are promising for numerous applications that require a small footprint, high output power and high efficiency, such as data communications, sensing and spectroscopy. Electrically pumped microcombs have been recently demonstrated via the integration of gain chips with high-quality-factor integrated resonators. However, the overall optical power remains well below what is necessary for practical solutions.

Fabrication-induced imperfections in photonic wire waveguides, such as roughness, stitching errors, and discontinuities, degrade their performance and thereby lower the yield of large-scale systems. This degradation is primarily due to the high insertion losses induced by imperfections, which scale nonlinearly with the index contrast in wire waveguides. Here we investigate the influence of discontinuities in photonic waveguides and later show a platform that is robust to fabrication imperfections.