Houfu Dai on Muck Rack

Houfu Dai

As seen in: Nature, SCIENMAG
Is this you? As a journalist, you can create a free Muck Rack account to customize your profile, list your contact preferences, and upload a portfolio of your best work. Claim your profile

Get in touch with Houfu

Contact Houfu, search articles and posts on X, monitor coverage, and track replies from one place.

Learn more about Muck Rack

Actions

Share this page

Is this you?

As a journalist, you can create a free Muck Rack account to customize your profile, list your contact preferences, and upload a portfolio of your best work.
Claim your profile

Articles

Effect of inclusions on polished Si removal mechanism via MD - Scientific Reports

|
By Haixia Yue, Song Tang, Xiaoqin Chen, Houfu Dai, Song Wei
| Nature Verified
Abstract In this study, molecular dynamics simulations is used study the mechanism of diamond abrasive polishing on mono-crystalline silicon containing circular inclusions. The variation in coordination number, polishing force, friction coefficient, potential energy, scratching temperature, and dislocation were analyzed and studied by changing the size of inclusions in monocrystalline silicon.
Open in Who Shared Issue with article?

Influence of Inclusions on Removal Mechanism of Polished Monocrystalline Silicon Based on Molecular Dynamics

|
By Haixia Yue, Song Tang, Xiaoqin Chen, Houfu Dai
| preprints.org
Submitted: 08 October 2025 You are already at the latest version In this study, the process of diamond abrasive polishing monocrystalline silicon with circular inclusions was simulated by molecular dynamics. The variation in coordination number, polishing force, friction coefficient, potential energy, polishing temperature, and dislocation were analyzed and studied by changing the size of inclusions in monocrystalline silicon.
Open in Who Shared Issue with article?

Numerical simulation of materials-oriented ultra-precision diamond cutting:

|
By Liang Zhao, Junjie Zhang, Jianguo Zhang, Houfu Dai
| SCIENMAG
Publishing in the International Journal of Extreme Manufacturing (IJEM), researchers from Harbin Institute of Technology, Huazhong University of Science and Technology, Guizhou University and Ruhr-University Bochum present a brief review on the application of numerical simulations in addressing the impact of properties and microstructures of workpiece materials on the diamond cutting mechanisms of different types of workpiece materials, such as metallic, hard brittle materials and composite...
Open in Who Shared View Duplicates (3) Issue with article?
See all 3 articles
 •  Privacy  •  Terms  •  Security and Legal  •   •   •   • 

© 2026 Muck Rack

SOC 2® Certified