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Kalar Rajendiran on Muck Rack

Kalar Rajendiran

California, Silicon Valley
As seen in: SemiWiki.com, Chip Estimate, Dataweek
CEO, Confera Corporation
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Articles

Consolidation and Competition: Who is Winning the $4.5 Billion Interface IP Race?

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By Kalar Rajendiran
| SemiWiki.com
Threads XF\Mvc\Entity\ArrayCollection Object ( [entities:protected] => Array ( [25482] => ThemeHouse\XPress\XF\Entity\Thread Object ( [_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 57 [rootClass:protected] => XF\Entity\Thread [_useReplaceInto:protected] => [_newValues:protected] => Array ( ) [_values:protected] => Array ( [thread_id] => 25482 [node_id] => 2 [title] => Meta to put AI chip into production in September as it looks to double computing capacity, memo shows [reply_count] => 0...
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5G Archives

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By Bernard Murphy, Kalar Rajendiran, Mike Gianfagna
| SemiWiki.com
Threads XF\Mvc\Entity\ArrayCollection Object ( [entities:protected] => Array ( [25208] => ThemeHouse\XPress\XF\Entity\Thread Object ( [_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 57 [rootClass:protected] => XF\Entity\Thread [_useReplaceInto:protected] => [_newValues:protected] => Array ( ) [_values:protected] => Array ( [thread_id] => 25208 [node_id] => 2 [title] => DRAM/HBM supply-demand balance [reply_count] => 10 [view_count] => 890 [user_id] => 323177 [username] => Ole Hoejlund...
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Feed Forward Intelligence: Enabling Testability in the Chiplets Era

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By Kalar Rajendiran
| SemiWiki.com
The semiconductor industry is entering a new era in which advanced packaging and chiplets-based architectures are becoming the primary drivers of system-level innovation. As traditional process-node scaling becomes increasingly complex and expensive, manufacturers are turning to heterogeneous integration, combining multiple dies within a single package to deliver higher performance, lower power consumption, and greater design flexibility.
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