Skip To Main Content
Kunming Yang on Muck Rack

Kunming Yang

As seen in: Nature, Wiley Online Library, ACS Publications
Is this you? As a journalist, you can create a free Muck Rack account to customize your profile, list your contact preferences, and upload a portfolio of your best work. Claim your profile
Back to Kunming Yang’s profile

Articles by Kunming Yang

Integrated machine learning and multi-omics analysis identifies ALOX5 as a potential therapeutic target for tubulointerstitial inflammation in diabetic kidney disease

|
By Wei Lu, Yiyao Deng, Yongqiang Zhang, Kunming Yang, Xue Lu, Ju Zhang, Mingming Liu, Hongyan Ren, Xin Xu, Lu Liu, Fangfang Yu, Yuan Ma, Yan Zha, Jing Yuan, Likang Zhai, Qiuling Xue, Lunju Luo, Dengmei Ao
| Nature Verified
Abstract Diabetic kidney disease (DKD) is a leading cause of renal failure. Inflammation of the renal tubules and interstitium is a critical factor in the progression of DKD; however, the key regulatory genes and characteristics of the immune microenvironment remain poorly understood. This study aims to identify key inflammatory biomarkers in the renal tubule tissues of DKD patients and to elucidate their potential immunoregulatory mechanisms.
Open in Who Shared Issue with article?

Ultralow Resistivity of Copper Nanofilms Enhanced by Cubic Boron Nitride Coherent Interface

|
By Jiamiao Ni, Naiqi Chen, Boan Zhong, Kunming Yang
Open in Who Shared Issue with article?

Ultralow Resistivity of Copper Nanofilms Enhanced by Cubic Boron Nitride Coherent Interface

|
By Jiamiao Ni, Naiqi Chen, Boan Zhong, Kunming Yang
| ACS Publications
Surfaces, Interfaces, and ApplicationsJuly 21, 2025 Jiamiao Ni State Key Lab of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, People’s Republic of China Naiqi Chen State Key Lab of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, People’s Republic of China Boan Zhong State Key Lab of Metal Matrix Composites, School of Materials Science and Engineering,...
Open in Who Shared Issue with article?

Enhanced Heat Transport Capability across Boron Nitride/Copper Interface through Inelastic Phonon Scattering

|
By Jingjing Wang, Ziyang Wang, Kunming Yang, Naiqi Chen
| Wiley Online Library Verified
PDF ShareShare Abstract Interfacial thermal resistance plays a critical role in heat dissipation, when the mean free paths of heat energy carriers approach or exceed the characteristic lengths of devices. Deep understanding on electron and phonon scattering, as well as their coupling behaviors are of importance for interfacial heat transport enhancement.
Open in Who Shared Issue with article?
Show More