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Abstract The quality of the barrier layer (BL) directly determines the long-term stability of thermoelectric (TE) modules. Conventional BLs struggle to simultaneously achieve thermal expansion matching with TE materials and robust diffusion-blocking capability. Here we show a bimetallic multilayer BL strategy that ensures thermal expansion matching while constructing a controllable interfacial stress field to inhibit element diffusion.
As a journalist, you can create a free Muck Rack account to customize your profile, list your contact preferences, and upload a portfolio of your best work.
