Dale Wilson

Siemens Digital Industries Software and Arizona State University have introduced a new online microcredential aimed at closing the industry's growing shortage of job-ready printed circuit board (PCB) designers. The program, called “PCB Design Fundamentals: From Discovery to Production,” went live on July 28, 2026, and is offered through ASU's Ira A. Fulton Schools of Engineering in partnership with Siemens.

Quectel Wireless Solutions has launched the FCE870X and FME170X, a pair of tri-band Wi-Fi 7 modules with integrated Bluetooth 6.0 aimed at set-top boxes, gaming devices, digital signage, and other connectivity-hungry consumer electronics. Built around Synaptics' SYN4384 chipset, the two modules offer an identical feature set in different footprints, letting designers pick embedded or modular integration without sacrificing performance.

Powering AI processors is not a simple power delivery design exercise. It is one of the most formidable power engineering challenges of our time. The conventional multiphase voltage regulation approach falls short on two attributes: current gain and current density. Both are critical for high-power loads. The conceptual underpinnings of a 48 V Factorized Power Architecture (FPA) are quite straightforward.