Hyeonyeob Seo

Abstract Recent advancements in implantable bioelectronic devices have increased the demand for biocompatible energy sources with long-term electrochemical and mechanical stability. Here, we present a tough hydrogel-based supercapacitor (THBS) fiber, fabricated via a thermal drawing process (TDP), that enables the integration of all components—electrodes, electrolyte, current collectors, and encapsulation—into a single, unified, and mechanically robust fiber-shaped architecture.

Abstract Packaging in stretchable electronics is crucial to protect components from environmental damage while preserving mechanical flexibility and providing electrical insulation. The conventional packaging process involves multiple steps that increase in complexity as the number of circuit layers multiply.

Abstract Intelligent digital apparel, which integrates electronic functionalities into clothing, represents the future of healthcare and ubiquitous control in wearable devices. Realizing such apparel necessitates developing meter-scale conductive fibers with high toughness, conductivity, stable conductance under deformation, and mechanical durability.