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Steve Park

As seen in: Nature, Royal Society of Chemistry, BioRxiv, JD Supra, PR Week, The Student Room, Eversheds Sutherland, Business Better (Podcast), Plant Services, QOSHE and
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Articles

Durable skin-integrated liquid metal-based conductive tattoo for imperceptible and untethered human machine interfaces

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By Je Hyeong Kim, Gyeongsuk Park, Dongeun Kim, Hanbit Jin, Minu Kim, Seungkyu Lee, Minhyung Lee, Youngju Son, Sangyong Jon, Hye Jin Kim, Steve Park, Jung Rak Choi
| Nature Verified
Abstract Electronic tattoos (e-tattoos) hold great potential for next-generation wearable electronics, but their widespread adoption is limited by challenges in electrical conductivity, mechanical durability, and user comfort. In this study, we introduce an Conductive and Durable EGaIn Particle (CDP) ink designed for imperceptible, untethered, and on-palm skin-integrated e-tattoos to overcome these limitations.
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Universal cryogenic transfer of liquid metal particles in polymers for wafer-scale stretchable integrated electronics - Nature Communications

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By Hoon Lee, Seungkyu Lee, Hanbit Jin, Su Yeong Kim, Donghyun Lee, Jun Yang, Taehoon Lee, Byungkook Oh, Sang Yu Sun, Do-Wan Kim, Sihong Wang, Sung Gap Im, Hye Jin Kim, Sung-Min Park, Jihan Kim, Yang-Kyu Choi, Steve Park, Minyong Park, Junehyeok Kim, Young-Soo Lim
| Nature Verified
Abstract Gallium-based liquid metals (LMs) are promising materials for stretchable electronics due to their metallic conductivity and deformability. However, the fabrication of large-area stretchable integrated electronics using LMs on various polymers remains challenging due to their high surface tension, fluidity, and poor wettability.
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Self-packaged stretchable printed circuits with ligand-bound liquid metal particles in elastomer - Nature Communications

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By Hyeonyeob Seo, Gun-Hee Lee, Jiwoo Park, Yeonzu Son, Semin Kim, Kum Seok Nam, Jae-Young Bae, Hyunjun Kim, Seung-Kyun Kang, Steve Park, Jiheong Kang
| Nature Verified
Abstract Packaging in stretchable electronics is crucial to protect components from environmental damage while preserving mechanical flexibility and providing electrical insulation. The conventional packaging process involves multiple steps that increase in complexity as the number of circuit layers multiply.
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