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Microelectronic Equipment

As seen in: Optica
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Articles

Top-profile-prior-constrained inversion for bottom-parameter reconstruction of extreme ultraviolet mask phase defects

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By Jibin He, Microelectronic Equipment, Sikun Li
| Optica Verified
Accurate repair or compensation of buried multilayer phase defects in extreme ultraviolet (EUV) lithography requires reliable knowledge of their three-dimensional morphology, yet the bottom-profile parameters remain difficult to recover from a single aerial-image observation.
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Analysis and compensation of alignment error in laser scanning heat-mode lithography system - Applied Physics B

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By Optoelectronics Engineering, Microelectronic Equipment
| link.springer.com
Abstract Alignment error significantly influences the fabrication quality of micro/nano structures in laser scanning heat-mode lithography systems. This paper presents an effective compensation strategy to address this issue. A laser heat-mode lithography system is established with a tightly focused objective lens and a grid scanning strategy, achieving a minimum grid size of 6 nm.
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