Eric Bogatin on Muck Rack

Eric Bogatin

Longmont
As seen in: Signal Integrity Journal, EE Times, EDN: Voice of the Engineer, All About Circuits, EE Times Asia, PCBDesign007, Nuts and Volts, Connector Tips
I am a physicist and signal integrity evangelist with strong interests high speed electronics, science journalism, astronomy, astrophysics and cosmology.
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Articles

The Role of Copper Pour and Picket Fence vias in Digital Designs

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By Eric Bogatin, Harish Kamineni, Amphenol TCS
| Signal Integrity Journal Verified
Introduction Picket fence vias are used to stitch a copper pour region to a lower ground plane on a board. These are usually placed around the edges of where signal lines are routed, as shown in Figure 1. Figure 1 An example of a typical board with picket fence vias The stitching vias create a grounded coplanar microstrip (GCPMS) structure. What is the value of a GCPMS structure with picket fence vias over a simple microstrip (MS) in high-speed digital applications?
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By Eric Bogatin
| Signal Integrity Journal Verified
In 2005, noted futurist Ray Kurzweil published his book The Singularity is Near in which he applied his Law of Accelerating Returns to extrapolate computational performance. The Law of Accelerating Returns applies Moore’s law to all technological advances. By whichever metric selected, the performance of technology increases exponentially over time rather than linearly. This is a consequence of the differential equation that technology advances obey.
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Roll Your Own TDR

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By Eric Bogatin, Supreeth Laderpet Yadubala
| Signal Integrity Journal Verified
TDRs are one of the most valuable tools an SI engineer uses to characterize an interconnect or debug a problem in a high-speed channel, but they are often expensive and not always available. This paper demonstrates how a practical TDR can be built in just a few minutes using commonly available lab components, including the ability to plot the impedance profile of a transmission line.
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